Mid-Level Wire Bond Process Engineer - On-site in Lapu-Lapu

About the Role

We are seeking a Mid-Level Wire Bond Process Engineer to join our team in Lapu-Lapu, Central Visayas. This role is crucial in enhancing our semiconductor manufacturing processes. You will focus on thermosonic wire bonding, ensuring high-quality production standards. If you have a passion for engineering and a desire to work in a dynamic environment, this position is for you.

As a key player in our operations, you will be responsible for defining and optimizing wire bonding parameters. Your expertise will help us maintain our competitive edge in the semiconductor industry. Explore more about our job opportunities and see how you can contribute.

Responsibilities

• Own, characterize, and sustain the thermosonic wire bond process to ensure efficiency.
• Define, sustain, and optimize key wire bonding parameters for improved quality.
• Establish and maintain the recipe management system for consistency.
• Troubleshoot and drive actions on critical wire bond losses to minimize downtime.
• Manage the capability of bonders and qualify wires for production standards.
• Prepare evidence for customer audits and ensure adherence to quality standards.

Requirements

• Bachelor’s degree in Engineering (Industrial, Manufacturing, Electronics, or related field).
• At least 3 years of experience in semiconductor manufacturing.
• Minimum of 2 years focused on thermosonic wire bonding processes.
• Practical experience with K&S/ASM/Shinkawa UTC platforms is essential.

Benefits

We offer a competitive salary and a supportive work environment. Enjoy work-life balance with weekends off and opportunities for professional growth. Our team values collaboration and continuous improvement. Join us and be part of a company that prioritizes your well-being and career advancement. For more details on our salary structure, visit our website.

Apply now and take the next step in your career as a Wire Bond Process Engineer in Lapu-Lapu!

• Bachelor’s degree in Engineering (Industrial, Manufacturing, Electronics, or related field).
• At least 3 years of experience in semiconductor manufacturing.
• Minimum of 2 years focused on thermosonic wire bonding processes.
• Practical experience with K&S/ASM/Shinkawa UTC platforms is essential.

• Own, characterize, and sustain the thermosonic wire bond process to ensure efficiency.
• Define, sustain, and optimize key wire bonding parameters for improved quality.
• Establish and maintain the recipe management system for consistency.
• Troubleshoot and drive actions on critical wire bond losses to minimize downtime.
• Manage the capability of bonders and qualify wires for production standards.
• Prepare evidence for customer audits and ensure adherence to quality standards.